Panther Lake
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Intel’s Custom Panther Lake CPU for Handheld PCs
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Intel is entering the handheld gaming market with its new Panther Lake chips, aiming to create a dedicated gaming platform that could outperform current offerings. The company plans to develop custom Intel Core G3 variants specifically for handheld devices, leveraging the advanced 18A process to enhance GPU performance. This move places Intel in competition with other tech giants like Qualcomm and AMD, who are also exploring opportunities in the handheld gaming space. While specific details about Intel's gaming platform remain under wraps, further announcements are expected from Intel and its partners later this year. This matters as it signifies a growing trend toward more powerful and specialized handheld gaming devices, potentially transforming the portable gaming experience.
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Intel’s New Handheld Gaming Platform
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Intel is expanding its presence in the gaming hardware market by developing a new chip and platform specifically for portable gaming devices. Announced by Intel's Daniel Rogers at CES, this platform will utilize the Intel Core Series 3 processors, known as Panther Lake, which are the first to be manufactured using Intel's 18A process starting in 2025. This move marks Intel's deeper foray into the gaming industry, traditionally dominated by AMD, which has also recently announced new gaming processors and technologies. More details on Intel's handheld gaming products are expected to be revealed later this year, highlighting the competitive dynamics in the gaming hardware sector. Why this matters: Intel's entry into the handheld gaming market could shift the competitive landscape, challenging AMD's dominance and potentially leading to innovations and advancements in gaming technology.
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Intel Unveils Core Ultra Series 3 CPUs with 18A Process
Read Full Article: Intel Unveils Core Ultra Series 3 CPUs with 18A Process
Intel has unveiled its Core Ultra Series 3 CPUs, utilizing the long-awaited 18A process and a chiplet-based design that combines multiple silicon tiles on a foundational base tile via Intel's Foveros packaging technology. The compute tile, built using the 18A process, houses both the CPU cores and the neural processing unit (NPU), with configurations offering up to 16 CPU cores. The platform controller and high-end graphics tiles are produced at TSMC, while a simpler graphics version is made using Intel's older 3 process. These chips boast significant performance improvements, with claims of up to 60% faster multi-core CPU performance and 77% faster integrated GPU performance compared to previous models. Additionally, all Panther Lake chips include an NPU capable of up to 50 trillion operations per second, supporting advanced AI tasks and connectivity features like Wi-Fi 7 and Bluetooth 6.0. This launch marks a potential turning point for Intel, indicating progress in its 18A facilities and opening opportunities for third-party chip manufacturing. This matters because it showcases Intel's advancements in chip technology, potentially enhancing computing performance and efficiency across various devices, while also indicating a strategic shift in its manufacturing capabilities.